Sputtering Services

For your advanced materials research, a custom sputtering tool is available at Hi-Z. This tool is set up to fabricate unique structures. For example, Hi-Z’s proven sputtering system has grown repeatable alternating 10 nm layers of electrical conductors and 10 nm electrical insulators with >500 layers of each material. Also, semiconductor and metallic coatings have been applied to many different heated and unheated substrates to produce specific properties for distinctive applications.

Specifications for Hi-Z’s Sputtering System

Sputtering Sources

Four 3-inch Magnetron Sputtering Sources with Pneumatic Shutters (currently installed on the system or two 6-inch Magnetron Sources available for installation

Ultimate Base Vacuum: <1 x 10-7 Torr

Automatic Pressure Control by Control Valve

Source Power Supplies:

Two Pulse DC Power Supplies and two RF Power Generators with Automatic Impedance Matching Network


Real Time Adjustable Substrate Orientation (i.e., sputtering source)

Substrate Heating (up to 650C) available for 2-inch or 6-inch circular wafers

Substrate Spinning Available with No Substrate Heating

Deposition Capability

Many different sputtering materials: Au, Si, SiGe, SiO2, SiC, B4,B9C, Si3N4, Mo, Bi2Te3, etc. and other materials upon request. Heated or unheated substrates: silicon, alumina, fused silica, aluminum nitride, including polymers such Kapton and Upilex and many other materials. In many thin film configurations: Single Layer, Multi-Layer, Periodic Structures, Composition Varying Structures and Coatings. In different sputtering modes: DC, Pulse DC, or RF Magnetron Sputtering.